1.1 Historical development and evolution of MEMS/NEMS
3 min read•august 7, 2024
and shrink mechanical and electrical parts to micro and nano sizes. This makes devices smaller, more efficient, and able to do more. As things get tinier, new challenges pop up, like surface forces becoming a big deal.
Making these tiny systems borrows tricks from computer chip manufacturing. This lets us build complex gadgets with sensors and moving parts all on one chip. The push to make things smaller keeps driving new tech and cool applications.
Development of MEMS and NEMS
Miniaturization and Scaling Effects
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- combine electrical and mechanical components at the microscale, typically ranging from 1 to 100 micrometers (μm)
- Consist of miniaturized structures, sensors, actuators, and microelectronics integrated onto a silicon substrate
- Examples include accelerometers (smartphones), pressure sensors (automotive), and micromirrors (projectors)
- (NEMS) further reduce the size of MEMS to the nanoscale, typically below 100 nanometers (nm)
- Exploit the unique properties of materials at the nanoscale, such as increased surface area to volume ratio and quantum effects
- Potential applications include , , and molecular-scale switches
- drives the development of MEMS and NEMS, enabling the fabrication of smaller, more compact, and energy-efficient devices
- Reduces the size, weight, and power consumption of systems while increasing their functionality and performance
- Allows for the integration of multiple functions on a single chip, leading to the development of complex, multifunctional devices
- arise as devices are miniaturized, leading to changes in the dominant forces and physical phenomena governing their behavior
- Surface forces (adhesion, friction) become more significant relative to volume forces (gravity, inertia) at smaller scales
- Heat and mass transfer, fluid dynamics, and mechanical properties may differ from macroscale behavior due to increased surface area to volume ratio and quantum effects
Fabrication Techniques
Micromachining and Integrated Circuit Manufacturing
- Micromachining techniques enable the fabrication of MEMS and NEMS devices by selectively removing or adding material to create miniaturized structures
- involves etching into the substrate () to create three-dimensional structures
- builds structures on top of the substrate by depositing and patterning thin films (, metals, dielectrics)
- Examples of micromachining processes include , etching (wet, dry), deposition (evaporation, sputtering, ), and bonding (anodic, fusion)
- MEMS and NEMS fabrication leverages the well-established processes and infrastructure of the (IC) industry
- Compatibility with IC manufacturing allows for the integration of MEMS/NEMS devices with electronic circuits on a single chip
- Batch fabrication techniques enable the production of large numbers of devices simultaneously, reducing cost and increasing yield
- , lithography tools, and process control methods from the IC industry are adapted for MEMS/NEMS fabrication
Technological Advancements
Moore's Law and Miniaturization Trends
- , proposed by Intel co-founder in 1965, predicts that the number of on an integrated circuit doubles approximately every two years
- Drives the miniaturization of electronic devices and the development of more powerful, compact, and affordable computing systems
- Enables the integration of more functionality and processing power into smaller packages, facilitating the growth of MEMS and NEMS
- The continuous scaling of transistors and other electronic components has been a key enabler for the advancement of MEMS and NEMS technologies
- Smaller feature sizes allow for the fabrication of more intricate and high-performance MEMS/NEMS devices
- Improved lithography techniques (deep UV, extreme UV, electron beam) enable the patterning of nanoscale structures with high resolution and precision
- The convergence of MEMS, NEMS, and IC technologies has led to the development of complex, multifunctional systems on a chip (SoC)
- Integration of sensors, actuators, and processing units on a single substrate enhances system performance, reduces power consumption, and enables new applications
- Examples include lab-on-a-chip devices for biomedical diagnostics, wireless sensor nodes for environmental monitoring, and inertial navigation systems for autonomous vehicles
Key Terms to Review (24)
Bulk micromachining: Bulk micromachining is a fabrication process that involves the removal of significant amounts of substrate material to create three-dimensional structures and devices, typically in silicon. This technique is essential in the development of Micro and Nano Electromechanical Systems (MEMS/NEMS) because it allows for the realization of complex geometries, making it a cornerstone in the historical evolution of these technologies.
Chemical Vapor Deposition: Chemical vapor deposition (CVD) is a widely used process for depositing thin films of material onto a substrate through chemical reactions of gaseous precursors. This technique plays a crucial role in various fields, enabling the fabrication of high-quality materials and structures, especially in micro and nano technologies.
Cleanroom Environments: Cleanroom environments are specially designed spaces that maintain extremely low levels of environmental pollutants, such as dust, airborne microbes, and chemical vapors. These controlled settings are crucial for the fabrication and testing of Micro and Nano Electromechanical Systems (MEMS/NEMS), where even the smallest contamination can significantly impact the performance and reliability of devices. The historical development of MEMS/NEMS is closely tied to advancements in cleanroom technology, which has evolved to meet the stringent requirements for manufacturing at micro and nano scales.
Complex Multifunctional Devices: Complex multifunctional devices are advanced systems that integrate multiple functionalities into a single device, often at micro or nanoscale levels. These devices are designed to perform several tasks simultaneously, enhancing efficiency and performance in various applications such as sensing, actuation, and signal processing.
Gordon Moore: Gordon Moore is an American engineer and co-founder of Intel Corporation, best known for formulating Moore's Law, which predicts that the number of transistors on a microchip doubles approximately every two years, leading to an exponential increase in computing power. This principle has driven innovation in the semiconductor industry and significantly influenced the development of Micro and Nano Electromechanical Systems (MEMS/NEMS).
High-frequency resonators: High-frequency resonators are devices that can oscillate at frequencies typically greater than a few megahertz, often utilized in applications such as filters, oscillators, and sensors. These resonators exploit mechanical and electromagnetic resonance principles to achieve precise frequency control and signal processing, playing a crucial role in the advancement of Micro and Nano Electromechanical Systems (MEMS/NEMS). Their development has led to miniaturization and enhanced performance of electronic components.
Hugh Melton: Hugh Melton is a notable figure in the development of Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS), recognized for his contributions to the commercialization and practical applications of these technologies. His work has significantly influenced the evolution of MEMS/NEMS by bridging the gap between research and real-world application, showcasing how miniaturized devices can revolutionize various industries, including healthcare and consumer electronics.
Integrated Circuit: An integrated circuit (IC) is a miniaturized electronic circuit that combines multiple components, such as transistors, capacitors, and resistors, into a single chip. This technology has significantly transformed electronics by enabling the development of complex systems in a compact form, which is essential for the evolution of Micro and Nano Electromechanical Systems (MEMS/NEMS).
MEMS: MEMS, or Micro-Electro-Mechanical Systems, refers to a technology that combines mechanical and electrical components at a microscale to create devices that can sense, control, and actuate physical processes. This technology enables the production of tiny devices that are essential in various applications, ranging from automotive sensors to medical devices, showcasing a significant advancement in the evolution of miniaturization and automation.
MEMS Sensors in Automotive: MEMS sensors in automotive refer to microelectromechanical systems that integrate mechanical and electrical components on a microscale, playing a critical role in enhancing vehicle performance, safety, and efficiency. These sensors can measure various parameters such as acceleration, pressure, temperature, and more, leading to the evolution of smart and responsive automotive systems. As technology has progressed, these sensors have become smaller, more efficient, and increasingly sophisticated, driving innovation in the automotive industry.
Microelectromechanical Systems (MEMS): Microelectromechanical Systems (MEMS) are tiny integrated devices or systems that combine mechanical and electrical components at a microscopic scale, typically ranging from micrometers to millimeters. These systems are designed to perform a variety of functions, including sensing, actuation, and signal processing, and they have evolved significantly over time through advancements in technology and materials, making them integral to many modern applications across various industries.
Miniaturization: Miniaturization refers to the process of designing and producing devices or systems at a smaller scale, often leading to improved performance, efficiency, and integration. This trend is crucial in various fields, especially in technology and engineering, as it allows for the development of compact systems that can perform complex functions while using fewer resources.
Moore's Law: Moore's Law is the observation made by Gordon Moore in 1965 that the number of transistors on a microchip doubles approximately every two years, leading to an exponential increase in computing power and a decrease in relative cost. This principle has significantly influenced the historical development and evolution of micro and nano electromechanical systems (MEMS/NEMS), driving innovation and miniaturization in the technology sector.
Nanoelectromechanical Systems: Nanoelectromechanical systems (NEMS) are tiny devices that integrate mechanical and electrical components at the nanoscale, typically measuring in nanometers. These systems leverage the unique properties of materials at such small scales, allowing for enhanced performance and functionality in applications ranging from sensors to actuators. NEMS emerged from the evolution of microelectromechanical systems (MEMS), showcasing advancements in fabrication techniques and a broader range of applications.
NEMS: NEMS, or Nano-Electro-Mechanical Systems, are miniature devices that integrate mechanical and electrical components at the nanoscale. These systems are known for their ability to perform complex functions such as sensing, actuation, and signal processing, with applications ranging from telecommunications to biomedical devices. The development of NEMS has evolved from the earlier MEMS technology, pushing the boundaries of miniaturization and performance.
Patent for MEMS Accelerometer: A patent for a MEMS accelerometer is a legal document that grants exclusive rights to an inventor or assignee for a specific MEMS-based device that detects acceleration forces. This innovation is crucial in various applications, such as automotive systems, consumer electronics, and aerospace, where precise motion sensing is vital. Patents play a significant role in protecting intellectual property, encouraging advancements, and fostering the growth of MEMS technology by ensuring inventors can capitalize on their creations.
Photolithography: Photolithography is a process used in microfabrication to transfer patterns onto a substrate, typically using light to selectively expose photoresist materials. This technique is crucial for the development of MEMS and NEMS, as it allows for the precise fabrication of intricate structures and devices at micro and nano scales.
Polysilicon: Polysilicon, or polycrystalline silicon, is a material composed of multiple small silicon crystals, and it serves as a crucial component in the fabrication of micro and nano electromechanical systems (MEMS/NEMS). This material has been integral in the historical evolution of these systems, primarily due to its advantageous electrical and mechanical properties. Polysilicon is commonly used in various fabrication processes such as surface and bulk micromachining, where it contributes to the development of sensors, actuators, and other essential MEMS/NEMS components.
Scaling Effects: Scaling effects refer to the changes in the behavior of materials and systems as their size is reduced to the micro or nanoscale. This phenomenon is crucial in understanding how physical properties, such as mechanical strength, thermal conductivity, and electrical resistance, vary when transitioning from macro-scale to micro/nanoscale dimensions. As devices shrink, their performance characteristics can differ significantly from larger counterparts, leading to innovative applications and challenges in design and manufacturing.
Silicon wafer: A silicon wafer is a thin, flat piece of silicon crystal used as a substrate for the fabrication of micro and nano devices. It serves as the foundational material in the production of integrated circuits and various microelectromechanical systems (MEMS) by providing a surface for the deposition of layers and structures essential for device functionality. The silicon wafer has become critical in the historical development of semiconductor technology and plays a significant role in advanced packaging techniques.
Surface micromachining: Surface micromachining is a fabrication process used to create small mechanical devices by depositing and patterning thin layers of material on a substrate. This technique is pivotal in the production of microelectromechanical systems (MEMS), as it allows for the integration of various materials and functionalities on a single chip. The process contrasts with bulk micromachining, which involves etching away bulk material to form structures, making surface micromachining particularly important in the development of complex and compact devices.
System on a Chip: A system on a chip (SoC) is an integrated circuit that consolidates all components of a computer or electronic system onto a single chip. SoCs typically include a processor, memory, input/output ports, and secondary storage, enabling enhanced performance, reduced physical size, and lower power consumption in devices like smartphones, tablets, and embedded systems. The evolution of SoCs has played a crucial role in the advancement of micro and nano electromechanical systems (MEMS/NEMS), leading to more efficient and compact designs.
Transistors: Transistors are semiconductor devices used to amplify and switch electronic signals and electrical power. They are fundamental components in modern electronics, enabling the development of complex circuits, microprocessors, and various MEMS/NEMS applications. Transistors have evolved over time from large vacuum tubes to miniature silicon chips, significantly influencing the historical advancements in technology and enabling the integration of nanoscale devices such as carbon nanotubes and graphene-based structures.
Ultra-sensitive sensors: Ultra-sensitive sensors are advanced devices capable of detecting minute changes in physical quantities, such as pressure, temperature, or chemical concentrations. These sensors have evolved significantly over time, becoming integral components in various applications, including medical diagnostics and environmental monitoring, by enabling real-time data collection and analysis with unprecedented accuracy.